HAI develops AI-driven semiconductor analysis
HAI joins NXP and Radboud University in advanced semiconductor research project
What happens when hyperspectral imaging, AI and semiconductor technology come together? That question is at the heart of the new MUSICA research project, a public-private collaboration focused on improving failure analysis for increasingly complex semiconductor chips and electronic systems.
The project brings together researchers from — including Prof. Dr. and Dr. — together with industrial partners , and.
For HAI, the project is another strong example of how collaboration between industry and academia accelerates innovation. HAI regularly participates in public-private research initiatives together with partners such as , and , combining industrial data expertise with applied scientific research.
Semiconductor reliability is becoming increasingly important
Semiconductors are the backbone of modern technology. They power everything from smartphones and vehicles to industrial systems and medical equipment. As semiconductor designs continue to increase in complexity, analyzing and understanding chip failures becomes significantly more challenging.
Even microscopic defects can impact reliability, safety and operational continuity. Detecting these defects early — and understanding their root causes — is therefore becoming increasingly important for manufacturers and technology providers worldwide.
The MUSICA project addresses this challenge by developing a new integrated spectroscopy and data analysis platform capable of detecting and classifying failures in advanced semiconductor devices with much greater sensitivity.
Within the project, researchers combine advanced spectroscopy techniques, hyperspectral imaging and modern data science methodologies to identify patterns and anomalies that are difficult to detect using traditional approaches. AI technologies also play a role in analyzing the rapidly growing volumes of measurement and imaging data generated during the research process.
De rol van HAI: schaalbare data-analyse mogelijk maken
Within MUSICA, HAI contributes its expertise in industrial data infrastructures and scalable analytics platforms.
The HAI Cloud Data Platform, running on Microsoft Azure, is used as the central data environment for integrating, processing and analyzing large volumes of research and measurement data.
This enables researchers and industrial partners to work with structured, contextualized and scalable datasets that support advanced analytics and future AI model development.
The HAI Cloud Data Platform is widely used within the food industry. This time, however, the project is not about potato chips, but semiconductor chips. 😉
For HAI, the project demonstrates how industrial-grade data platforms can support innovation — not only in process industries, but also in advanced semiconductor research and high-tech manufacturing environments.
Combining expertise across disciplines
One of the unique aspects of the MUSICA project is its interdisciplinary approach.
The collaboration combines expertise in spectroscopy, semiconductor technology, hyperspectral imaging, instrumentation and data science into a single integrated research environment.
Each consortium partner contributes highly specialized knowledge. contributes expertise and instrumentation for scanning probe imaging, while provides valuable semiconductor industry expertise and real-world application context.
According to the researchers involved, combining physical instrumentation research with modern data science methodologies opens the door to a new generation of semiconductor analysis capabilities.
Bouwen aan de volgende generatie chipdiagnostiek
By improving the detection and analysis of semiconductor defects, the MUSICA project aims to contribute to more reliable electronics, more efficient production processes and longer-lasting semiconductor devices.
In the long term, innovations in failure analysis can contribute to safer transportation systems, more reliable medical technologies, more resilient infrastructure and reduced material waste.
The MUSICA project is funded by NWO under the project title: “Broad Spectrum and Time-Resolved Optical Beam-Induced Resistance Change (OBIRCH) for Failure Analysis.”
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